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SEMICONDUCTOR SERVICES

Precision processing for advanced materials.

Integrated grinding, polishing, fixtures and consumables engineered for SiC, GaN, silicon, quartz, sapphire and glass applications.

Advanced semiconductor materials
300 mmWafer processing capability
MATERIAL KNOWLEDGE

Process development starts with material behavior.

Surface quality, flatness, thickness and edge requirements differ by material. Our team develops the right process around your specifications and production goals.

Talk with an engineer →
Silicon Carbide SiCGallium Nitride GaNSilicon Wafer SiQuartz SiO₂Sapphire Al₂O₃Optical Glass Glass
HOW WE WORK

A clear path from requirement to production.

01

Review

Material, dimensions, surface and quantity requirements.

02

Develop

Fixture, tooling and process parameter development.

03

Validate

Sample processing, measurement and quality confirmation.

04

Produce

Controlled processing with repeatable production support.

START YOUR PROJECT

Need a precision processing solution?

Contact Create-Win

Semiconductor Precision Processing

From chip-scale parts to wafers up to 300 mm, we can thin, mirror-polish, coat, and cut materials to the required shape.

Advanced Material Processing