CWE provides cutting, grinding, polishing, and coating services for any material, whether it is compound, quartz, glass, or metal
We can process wafers up to ±300mm into thin, mirror-like, film-coated, or cut shapes as needed
In addition to silicon wafers, we also handle various chips such as silicon carbide, gallium nitride, gallium arsenide, and glass
Utilizing required semiconductors and optical equipment, we provide various glass processing services
Utilizing 3D drawing analysis and automated control for coating various products
In the face of rapidly changing technology, CWE always upholds a relentless spirit, researching various material processing and coating，
Over the past ten years since its establishment, we have mastered multiple processing technologies, providing better customized services for our clients。
